HansiSeal® PU 2201 is a solvent-free and self-leveling two-component electro-potting compound, based on polyurethane. The product consists of a resin containing hydroxyl groups and an aromatic isocyanate hardener.
This product is also available with a "low emission" hardener. The residual monomer content of the hardener is ≤ 0.1%, thereby exempting it from the training requirements under the REACH Regulation 2020/1149 concerning isocyanates.
Application HansiSeal® PU 2201 is used for the encapsulation and sealing of small electrical and electronic components. It has good adhesion to metals and plastics. PP, PE and PTFE cannot be glued with it without pre-treatment.
It is highly recommended for potting application for electronic parts, especcially for circuit borads. This process provides excellent protection against environmental factors such as moisture, dust, and mechanical stress, ensuring the longevity and reliability of the electronic parts.
Size available:
25 L hobbock
200 L barrel
others on request
Due to its innovative design, the adhesive can be cross-linked with both conventional isocyanate-containing hardeners and hardeners with an isocyanate content of less than 0.1%, without altering its properties.
The highly adaptable polyol component can be tailored to the specific application, whether as a low-viscosity liquid or a solid mass.
The pot life of the product can be adjusted according to customer requirements.
The best way to use the product is with an automatic dosing machine and via a static mixer. If you have any further questions, please do not hesitate to contact our technical service.
Surface treatment:
The surface to be bonded must be dry, free of grease and dust and must not have any other contamination. Oxide layers on metal surfaces or release agents on plastic surfaces should be removed. The formation of condensation on the surfaces must also be avoided.
Curing conditions:
The product can be cured at room temperature. Curing can be accelerated by moderate heating to max. 60 °C.
Storage conditions:
Moisture has a negative effect on resin and hardener. Therefore, both components must be stored in tightly sealed containers. Keep the containers well closed and store in a dry place.
The product must be stored at temperatures between 10 and 30°C. Direct sunlight, heat, frost, or moisture must be avoided.
Fill out the form to get the data sheet via email and reach out if you have further questions.
